Cornell University (USA) researchers have announced a new breakthrough in the field of semiconductor technology, promising to produce ultra-thin devices.
Promises to create ultra-thin devices
According to the latest issue of Nature, the Cornell University team devised a new and extremely effective way to produce a material called metal semiconductor dichalcogenide (TMD).
Semiconductor devices are getting thinner and thinner with TMD material technology - (Photo: Nature)
TMD is an ultra-thin film, with a thickness equivalent to three atoms overlapping, opening up the prospect of wide application in many high-tech devices, from solar panels to wearable and flexible devices.
' Our work has brought TMD to the stage of promising to be able to create equipment ,' said co-author Saien Xie.
TMD, like the metamaterials like graphene, can provide a stable block of compressed materials so engineers can increasingly assemble as many circuits as possible.
However, due to its thickness only stopping at 3 atoms, TMD production process often faces high risk of breaking and failing.
With the new approach, the university researchers mixed the diethylsulfide and a metal hexacarbonyl compound on a piece of silicon, and then steamed them for 26 hours with hydrogen gas.
The results were extremely impressive. In a batch of 200 units, only 2 samples failed, ie the success rate was up to 99%.
It still has to wait at least a few years before new semiconductor device products are produced on a commercial scale, but analysts have drawn the perspective of a new era of paper-thin devices. strong again.
