Asus has just announced the Zenfone Max Shot and Zenfone Max Plus M2 with the Snapdragon SiP 1. chip What is it different from the previous Snapdragon chips that we all know?
So far, Qualcomm is still famous for designing and manufacturing SoC (System-on-Chip). Inside each of Qualcomm's SoC Snapdragon includes many components such as CPU, GPU, modem, image processor (ISP) . All these components are encapsulated in a Snapdragon chip that we are familiar with. nowadays.
Snapdragon System-in-package (SiP).
However, Qualcomm continues to open its ambition to integrate more things into a single chip, and SiP is born. The word SiP in the "Snapdragon SiP" stands for System-in-Package. Besides owning components like SoC above, Qualcomm's SiP also includes RAM / ROM memory, Wi-Fi management chip, Bluetooth, audio . In fact, Qualcomm said inside the Snapdragon SiP 1 has more than 400 components, all packed in a tiny chip.
Inside the Snapdragon SiP, there are more than 400 component components.
At this point, the question is: "What is the problem with the previous way (isolated chips) that Qualcomm has to merge them into one?"
In the process of developing a new smartphone, firms have to look for each component component from many different suppliers. In order to be able to find the most suitable components with product properties that require a lot of time and cooperation relationship. In addition, it also creates cost problems for firms, when they will have to balance components at the most appropriate price, in addition to the more components to print on the circuit board, the production cost will also increase. high.
More importantly, since component components come from many sources, smartphone companies sometimes cannot control the quality of end products when these components work together. In addition, having too many separate chips on the motherboard will leave manufacturers with no room for other components.
Compared to a smartphone using a traditional solution (right), it can be seen that the board of smartphones uses the "airy" Snapdragon SiP chip.
Qualcomm solved the problem with SiP. All the above difficulties of manufacturers will be transferred to Qualcomm. Qualcomm itself will select components and then test them to ensure the best compatibility and stability. Qualcomm will then sell SiP to smartphone manufacturers, and all these smartphone makers do is solder it to their boards!
Because SiP only has a single chip, and Qualcomm is a big company and has mass production capabilities, this will help reduce the time, cost and assembly stages for smartphone vendors. Thanks to this advantage, smartphone firms can spend the time and cost they save to develop other features, or offer a more affordable price to attract customers. Asus said that thanks to SiP's minimalist size, it has been able to integrate a high-capacity battery (4000mAh) for the two new Zenfone while keeping the size and weight relatively light.
Currently only the first two smartphones use the Snapdragon SiP chip, the Zenfone Max Shot and the Zenfone Max Plus M2. These two models are equipped with Snapdragon SiP 1 chip, for performance equivalent to 450 Snapdragon. Currently Qualcomm has not said that in the future, there will be other smartphones equipped with this solution.
With cost advantages, the Snapdragon SiP is best suited for low-cost and mid-range smartphones. As for high-end machines, we will probably have no chance of seeing this chip, at least in the near future. High-end smartphones often have many complicated components that the Snapdragon SiP cannot meet. In addition, their CPUs and GPUs have high performance and high heat dissipation, so "gathering" them into a chip is not a good idea.