IBM discovered how to cool the new chip

Scientists at IBM Computer Research Laboratory Zurich have discovered that the new glue technology in the chip manufacturing process can cool this device more efficiently.

Glue is used to mount transistors of devices such as microprocessors or chipsets with cooling elements that help heat the chip. However, with the currently popular type of glue, because there are embedded metal particles or micro-ceramics to conduct electricity, it is still more difficult for the device to 'fire down' the device.

Researchers at the Zurich lab found the cause of this problem, which is how to use the glue in chip manufacturing. Through observation they discovered, when the chip is attached to the cooling device of the transistor, the micro particles contained in the glue are stacked to form a cross, which leads to the glue that cannot be spread evenly over chip surface. Therefore, to solve the situation, they create more small grooves at the bottom of the radiator, helping glue to spread out as desired.

As a result, with a thinner adhesive layer, the efficiency of chip heat dissipation has tripled. IBM is deploying these types of grooves into chip manufacturing, but does not say when it will begin to apply the newly discovered glue application technique.

Do Duong