IBM released the first 3D Chip

Micron, one of the world's largest chip makers, will start producing a new memory, using silicon vias (TSVs) technology. This is a three-dimensional technique that allows piling up chips and connecting them via vertical lines (vias).

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This advanced chip manufacturing technology allows hybrid memory (HMC) to achieve speeds up to 15 times faster than current technology.

3D memory will be produced at IBM's research headquarters in East Fishkill, NewYork, using the company's 32nm high-K metal process technology.

IBM's new 3D technology is used to connect 3D microchips, which will be
Commercial production platform of new memory blocks. (Source: physorg.com)

HMC uses advanced technology TSVs - longitudinal electrical conduit of individual chips to create high performance suitable for DRAM. HMC provides bandwidth and performance far beyond the capabilities of the current device, and also requires 70% less power to transfer data - only 10% of normal memory.

HMC will create a new generation of chips with a variety of applications, from large-scale networking to high-performance computing, industrial automation and consumer products.

"This is an important milestone in the industry to produce 3D semiconductors , " said Subu Iyer of IBM. "We will roll out applications beyond normal memory, serving other industries in the next few years, the 3D technology chip will bring consumer products and we can see those. Strong improvement in battery life and device function ".