The first chip in the world has an internal cooling water pipe

IBM has just introduced technology to chip thousands of tiny hair-like plumbing pipes in one layer just one-billionth of a meter thick, sandwiched between circuits to reduce the heat of the processor.

This plumbing system is placed vertically in the processing circuit block, which IBM calls 3D chips (3-dimensional), which has good heat dissipation and reduces data transmission distance and enhances performance. It took nearly 10 years for IBM researchers to acquire a new microprocessor model and hit the market within five years.

Current microprocessors from Intel and AMD . all suffer from increased heat barriers along with the level of chip performance, especially when Intel launches products with up to 2 billion transistors.

In 2007, American engineers built tiny fan motors to create wind for molecules and cool chips, but this took space. In 2003, Stanford University (USA) introduced the Active Micro-Channel Cooling (AMC) technology to cool chips with water pipes but only on the surface, applied in Apple's Power Mac G5 desktop, out. eyes in 2004.

The tiny water pipes are located between sealed circuits to prevent leakage and cause short circuits.(Photo: BBC)